Look high integration industry layout of Nufront from the CITE
The three-day China electronic information fair (CITE) in Shenzhen convention and exhibition center has finished. At the exhibition Nufront with many TL7689 and NL6621 based intelligent solutions let domestic chip industry see an enterprise's efforts and opportunities. In IoT environment, Nufront's highly integrated single chip processor TL7689 and single chip Wi-Fi NL6621 intelligent solutions, has become the focus of the industry. At the same time, Nufront and foxconn companies cooperation also let the future market and industry environment get benefits.
In fact, fusion is not a new concept now. The fusion of computing technology and communication technology is an innovation to the traditional industry challenges. It brings the diversification of the development platform, new technology, new application to the integration of rapid development platform. International leading chip manufacturers have already sensed the pressure and the layout as early as possible. In 2011, nVidia graphics processor manufacturers spend $367 million for Icera, in order to supplement the board in the baseband and RF.
On September 27 last year, Nufront released two chips, AP + BP single chip solutions NL6621 TL7689/7688, single chip products and the corresponding single chip wi-fi solution.The biggest characteristic of these two chip is high integration.TL76XX will application processor (AP) and communication processor (BP) highly integrated on a chip, using the heterogeneous low-power high-performance quad-core processors, support GSM/WCDMA dual-mode system. NL6621 is wi-fi baseband and rf and highly integrated single chip, low power consumption MCU support 802.11 b/g/n, integrated with the TCP/IP protocol stack, standby power consumption is only 10 muA.
The CITE2014 shows the intelligent socket scheme based on NL6621, support the "puckering, porous", have the cloud management function, can be directly controlled by smartphone. It supports for LAN and wan control of the socket. At present the scheme has been adopted by the customer, will soon be listed on the transition.
High integration, software and hardware integration scheme will become the future market. It has carried on the long-term technology accumulation and the layout of the new shoreline, has a full set of chip design ability and ability to provide mature solution to the manufacturer.
(Reference: IT168 http://cio.it168.com/a2014/0417/1614/000001614294.shtml)